The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2008
Filed:
Oct. 18, 2004
Young Sang Byun, Kumi-shi, KR;
Kyung Su Chae, Taegu-kwangyokshi, KR;
Sang Ho Park, Pusan-kwangyokshi, KR;
SE Joon Baek, Pusan-Kwangyokshi, KR;
Young Sang Byun, Kumi-shi, KR;
Kyung Su Chae, Taegu-kwangyokshi, KR;
Sang Ho Park, Pusan-kwangyokshi, KR;
Se Joon Baek, Pusan-Kwangyokshi, KR;
LG.Philips LCD Co., Ltd., Seoul, KR;
Abstract
Loader and bonding apparatus for fabricating a liquid crystal display device, and a loading method thereof are disclosed, the method for loading a substrate by using a loader having an arm with a plurality of robot fingers, and a plurality of adsorption pads on each of the robot fingers at regular intervals for adsorbing a substrate, and a bonding apparatus having a plurality of adsorption pins mounted on the upper stage movable in up/down direction for adsorption of the substrate being loaded, including the steps of the loader adsorbing, and holding the substrate at a back side thereof, and inverting the substrate, by using the adsorption pads, positioning the inverted substrate under the upper stage of the bonding apparatus, moving down the adsorption pins on the upper stage, and adsorbing the substrate at the back side thereof through the adsorption pins, removing adsorption force of the adsorption pads, and the loader being moved out of the bonding apparatus, and moving up the adsorption pins, and securing the substrate to the upper stage, whereby permitting inversion of the substrate without using an inverting device, and to prevent sagging of a large sized substrate to enable easy loading of the substrate on the bonding apparatus.