The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2008
Filed:
Mar. 07, 2003
Maria Carvalho, Rio de Janeiro, BR;
Luiz Conrado, Rio de Janeiro, BR;
Luciene Demenicis, Rio de Janeiro, BR;
Walter Margulis, Huddinge, SE;
Daniele Seixas, Niterói, BR;
Maria Carvalho, Rio de Janeiro, BR;
Luiz Conrado, Rio de Janeiro, BR;
Luciene Demenicis, Rio de Janeiro, BR;
Walter Margulis, Huddinge, SE;
Daniele Seixas, Niterói, BR;
Ericsson Telecommunicacoes S.A., Sao Paulo SP, BR;
Abstract
An impedance-matching coupler () comprises a dielectric substrate () onto which a conducting strip () is disposed. A dielectric layer (), preferably a dielectric film, is formed on top of the conducting strip and the first dielectric layer to encircle the conducting strip. A metallic layer () is finally provided on top of the dielectric layer. The dielectric layer has a dielectric constant that is substantially higher that the dielectric constant for the dielectric substrate, preferably more than ten times higher. A dielectric film with a thickness of less than 100 μm is advantageous, preferably between 5 and 100 μm, and even more preferably between 10 and 70 μm. The thickness of the dielectric substrate is preferably larger than for the dielectric film, preferably more than ten time larger. The conducting strip has preferably a constant width. The dielectric film thickness is preferably larger than 10% of the conducting strip width.