The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2008

Filed:

Mar. 14, 2005
Applicants:

Michael J. Degerstrom, Rochester, MN (US);

Matthew L. Bibee, Bloomington, MN (US);

Daniel V. Hulse, Prior Lake, MN (US);

Inventors:

Michael J. Degerstrom, Rochester, MN (US);

Matthew L. Bibee, Bloomington, MN (US);

Daniel V. Hulse, Prior Lake, MN (US);

Assignee:

Xilinx, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
Abstract

Various apparatus for performing high frequency electronic package testing are disclosed. A test fixture assembly includes an electronics package having an interface structure, a mock-up IC, coupled to the interface structure for providing circuit connections, and a fixture board, coupled to the interface structure, wherein at least one of the fixture board and mock-up IC includes high frequency probe pads for providing a signal and ground point for high bandwidth test probing. Raw measurements are used for validation of the electronic package specifications when adequate test fixture bandwidth is available or included into circuit simulations models when a minimal phase error is acceptable, else phase and loss corrections are applied to the measurements.


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