The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2008

Filed:

May. 15, 2006
Applicants:

Hirochika Narita, Kanagawa, JP;

Ryuya Kuroda, Kanagawa, JP;

Inventors:

Hirochika Narita, Kanagawa, JP;

Ryuya Kuroda, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Method of manufacturing a solid-state image-sensing device includes: forming a composite lead frame which is a lead unit separated from a metal substrate surface by connecting a pair of lead frames having rectangular outer frame units, lead units formed integrally with the outer frame units within the frames, and bump units formed at one surface of the outer frame units, via the bump units of the lead frames on surfaces of both ends of the long plate-shaped metal substrate, filling up a gap between the surface of the metal substrate and the lead units with insulating resin, and forming an outer frame body by molding part of the composite lead frame so as to expose the connecting units and the lead unit to the outside, mounting a long plate-shaped solid state image sensing element on the composite lead frame, and cutting off the connecting units exposed to the outside.


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