The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2008

Filed:

Aug. 18, 2004
Applicants:

Yunlong Sun, Beaverton, OR (US);

Richard Harris, Portland, OR (US);

Ho Wai Lo, Portland, OR (US);

Brian Baird, Oregon City, OR (US);

Jay Johnson, Portland, OR (US);

Robert F. Hainsey, Portland, OR (US);

Inventors:

Yunlong Sun, Beaverton, OR (US);

Richard Harris, Portland, OR (US);

Ho Wai Lo, Portland, OR (US);

Brian Baird, Oregon City, OR (US);

Jay Johnson, Portland, OR (US);

Robert F. Hainsey, Portland, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/00 (2006.01); B23K 26/14 (2006.01); B23K 26/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link. The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a spike peak within the duration of the laser pulse. The timing of the spike peak is preferably set ahead of the time when the link is mostly removed. A specially tailored laser pulse power profile allows the use of a wider laser pulse energy range and shorter laser wavelengths, such as the green and UV, to sever the links without appreciable damage to the substrate and passivation structure material located on either side of and underlying the links.


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