The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2008

Filed:

Sep. 29, 2004
Applicants:

Seiji Ichiyanagi, Aichi, JP;

Jun Otsuka, Aichi, JP;

Manabu Sato, Aichi, JP;

Masahiko Okuyama, Aichi, JP;

Inventors:

Seiji Ichiyanagi, Aichi, JP;

Jun Otsuka, Aichi, JP;

Manabu Sato, Aichi, JP;

Masahiko Okuyama, Aichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 27/02 (2006.01); B32B 3/00 (2006.01); G03C 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A first ceramic substrate includes a substrate () and a glaze layer (), wherein the glaze layer has a surface having an Ra of 0.02 μm or less and a Ry of 0.25 μm or less. A second ceramic substrate is formed by subjecting a glass layer () formed on a surface of a substrate () to heating-and-pressurizing treatment, thereby forming a glaze layer () on the substrate (), and planarization-polishing the surface of the glaze layer. A third ceramic substrate includes a substrate (), a glaze layer () containing substantially no pores formed on the substrate () and the surface thereof being planarization-polished, and a wiring pattern (), wherein at least one first end of the wiring pattern is exposed to the glaze layer () surface of the substrate (), and at least one second end is exposed to another surface of the substrate ().


Find Patent Forward Citations

Loading…