The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2008
Filed:
Mar. 22, 2005
Applicants:
Chong Ho Kim, Chungcheongbuk-do, KR;
Dong Kuk Kim, Kyunggi-do, KR;
Hyo Soo Lee, Daejeon, KR;
Young Hwan Shin, Daejeon, KR;
Inventors:
Chong Ho Kim, Chungcheongbuk-do, KR;
Dong Kuk Kim, Kyunggi-do, KR;
Hyo Soo Lee, Daejeon, KR;
Young Hwan Shin, Daejeon, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Kyunggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method is directed towards fabricating a printed circuit board (PCB) having a thin core layer. In the method, a substrate, where a copper foil is formed on a release film and a prepreg, is employed as a base substrate and a core insulating layer is removed after the fabrication of the PCB, thereby reducing the thickness of the final product.