The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 18, 2008

Filed:

Jun. 10, 2003
Applicants:

Mary Wisniewski, Yorktown Heights, NY (US);

Emmanuel Yashchin, Yorktown Heights, NY (US);

Christina Landers, Wappingers Falls, NY (US);

Asya Takken, Brewster, NY (US);

Brian Trapp, Poughkeepsie, NY (US);

Inventors:

Mary Wisniewski, Yorktown Heights, NY (US);

Emmanuel Yashchin, Yorktown Heights, NY (US);

Christina Landers, Wappingers Falls, NY (US);

Asya Takken, Brewster, NY (US);

Brian Trapp, Poughkeepsie, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 15/00 (2006.01); G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A system and method is disclosed for assessing a probability of failure of operation of a semiconductor wafer. The method includes inputting risk factor data into a memory and inputting a plurality of wafers into a semiconductor fabrication manufacturing process. A subset of wafers is selected to obtain a sample population and at least one region of each wafer of the sample population is inspected. Circuit design data associated with each wafer of the sample population is obtained and one or more defects that present an increased risk to the operation of a particular wafer are identified. The identification is a function of the risk factor data, the inspecting step and the circuit design data. A probability of semiconductor wafer failure is calculated.


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