The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2008
Filed:
Sep. 27, 2004
Applicant:
Se-hoon Cho, Seongnam-si, KR;
Inventor:
Se-hoon Cho, Seongnam-si, KR;
Assignee:
Samsung Techwin Co., Ltd., , KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/12 (2006.01); G08B 13/14 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacturing a substrate for a circuit board includes forming a groove having a predetermined shape and pattern in at least one surface of a substrate formed of an insulating material, filling the groove with a conductive material, and forming a circuit pattern by hardening the conductive material filling the groove. The groove is preferably formed by impression with a die containing a pattern corresponding to the shape and pattern of the groove. A substrate and a smart label formed of the substrate are also disclosed.