The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2008
Filed:
Jan. 17, 2006
Steven P. Young, Boulder, CO (US);
Trevor J. Bauer, Boulder, CO (US);
F. Erich Goetting, Cupertino, CA (US);
P. Hugo Lamarche, Campbell, CA (US);
Patrick J. Mcguire, Cupertino, CA (US);
Kwansuhk OH, San Jose, CA (US);
Raymond C. Pang, San Jose, CA (US);
Bruce E. Talley, Louisville, CO (US);
Paul Ying-fung Wu, Saratoga, CA (US);
Steven P. Young, Boulder, CO (US);
Trevor J. Bauer, Boulder, CO (US);
F. Erich Goetting, Cupertino, CA (US);
P. Hugo Lamarche, Campbell, CA (US);
Patrick J. McGuire, Cupertino, CA (US);
Kwansuhk Oh, San Jose, CA (US);
Raymond C. Pang, San Jose, CA (US);
Bruce E. Talley, Louisville, CO (US);
Paul Ying-Fung Wu, Saratoga, CA (US);
Xilinx, Inc., San Jose, CA (US);
Abstract
A multi-product integrated circuit die includes at least two different portions, of which at least one portion can be deliberately rendered non-operational in some manner (e.g., non-functional, inaccessible, and/or non-programmable) within the package. A selection code storage circuit stores a product selection code. A first value of the product selection code selects the option where both the first and second portions of the first die are operational. A second value of the product selection code selects the option where only the first portion of the first die is operational. The selection code storage circuit can include non-volatile memory or a fuse structure, or the product selection code can be configured as a package bonding option. The product selection code can also enable boundary scan for the operational portion of the die, and omit from the boundary scan chain any portions of the die that are deliberately rendered non-operational.