The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2008
Filed:
Feb. 27, 2006
Minka Gospodinova-daltcheva, München, DE;
Harry Huebert, Aschheim, DE;
Rajesh Subraya, München, DE;
Jochen Thomas, München, DE;
Ingo Wennemuth, München, DE;
Minka Gospodinova-Daltcheva, München, DE;
Harry Huebert, Aschheim, DE;
Rajesh Subraya, München, DE;
Jochen Thomas, München, DE;
Ingo Wennemuth, München, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor device includes a plastic package, at least one semiconductor chip and a rewiring level. The rewiring level includes an insulating layer and a rewiring layer. The rewiring layer includes either signal conductor paths and ground or supply conductor paths arranged parallel to one another and alternately, or only signal conductor paths arranged parallel to one another. In the latter case, an electrically conducting layer of metal which can be connected to ground or supply potential is additionally provided as a termination of the rewiring level or in the form of a covering layer.