Optical package with double formed leadframe

Abstract

Packages for an optical integrated circuit die and a method for making such packages are disclosed. The package includes a die, a die pad, a plurality of lead fingers, and an encapsulating dielectric material. The downward second pad surface of the die pad bearing an integrated circuit is encapsulated by a bottom encapsulating dielectric material. The top encapsulating dielectric material provides the function for protecting the leadframe from severe environment. The top encapsulating dielectric material can be neglected if there is no threat on the integrated circuit die and the leadframe. Multiple of lead fingers are mounted on the printed circuit board. A portion of the printed circuit board is removed in order to provide an optical path for the light beam transmitted from a light source through the transparent bottom encapsulating dielectric material into the integrated circuit die. The method of making a package includes forming a leadframe including a die pad and a plurality of lead fingers. A die is attached on the downward second surface of the die pad. There are bonding wires electrically coupling the die and the lead fingers. Transparent dielectric encapsulating material covers the die, the die pad and a portion of the lead fingers. Finally, the package is mounted on a printed circuit board with flatly bended tip portion of the lead fingers.