The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2008
Filed:
Sep. 21, 2005
Masayoshi Isozaki, Chiba, JP;
Takashi Saito, Chiba, JP;
Hideki Andoh, Chiba, JP;
Nippon Steel Chemical Co., Ltd., Tokyo, JP;
Abstract
The present invention relates to a silicone resin composition that can be used for a roll film having small birefringence, the silicone resin composition being suitable for, for example, optical applications, and a window material for an automobile, the silicone resin composition having high heat resistance, the silicon resin composition being stained at a low level, the silicone resin composition having a low thermal expansion coefficient, the silicone resin composition enabling a transparent conductive film to be stably formed, and the silicone resin composition providing good winding property. The silicone resin composition contains: A) a silicone resin mainly composed of a polyorganosilsesquioxane having a cage-type structure in a structural unit, the polyorganosilsesquioxane being represented by [RSiO](wherein R is an organic functional group having a (meth)acryloyl group and n is 8, 10, or 12); B) an oligomer that is radically copolymerizable with the silicone resin, the oligomer containing an unsaturated group represented by —R—CR═CHor —CR═CHin a molecule, and the oligomer having a urethane bond; and C) an other unsaturated compound that is radically copolymerizable with the silicone resin. In the silicone resin composition, the silicone resin, the oligomer, and the other unsaturated compound are compounded at a weight ratio of 5 to 80:1 to 50:0 to 80.