The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2008
Filed:
Jun. 30, 2006
Jozef J. Van Dun, Zandhoven, BE;
Patrick J. C. Schouterden, Wachtebeke, BE;
Kalyan Sehanobish, Rochester, MI (US);
Peter F. Van Den Berghen, Graauw, NL;
Noorallah Jivraj, Lake Jackson, TX (US);
Johan Vanvoorden, Diepenbeek, BE;
Ruddy A. J. Nicasy, Westerlo, BE;
Ravi S. Dixit, Lake Jackson, TX (US);
Frederik E. Gemoets, Wommelgem, BE;
Jozef J. Van Dun, Zandhoven, BE;
Patrick J. C. Schouterden, Wachtebeke, BE;
Kalyan Sehanobish, Rochester, MI (US);
Peter F. van den Berghen, Graauw, NL;
Noorallah Jivraj, Lake Jackson, TX (US);
Johan Vanvoorden, Diepenbeek, BE;
Ruddy A. J. Nicasy, Westerlo, BE;
Ravi S. Dixit, Lake Jackson, TX (US);
Frederik E. Gemoets, Wommelgem, BE;
Dow Global Technologies Inc., Midland, MI (US);
Abstract
The invention relates to a polyethylene composition with a bimodal molecular weight distribution, methods for making the same, and articles made therefrom, such as high topload blow moldings and transmission and distribution pipes. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (HMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWD, of less than about 8. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.