The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2008
Filed:
Nov. 02, 2005
Kyung Ho Hwang, Yongin-si, KR;
Won MO Lee, Seoul, KR;
Kyung Ho Hwang, Yongin-si, KR;
Won Mo Lee, Seoul, KR;
Hynix Semiconductor Inc., Gyunggi-do, KR;
Abstract
Provided are a semiconductor device, adapted to be capable of fabricating the device having improved resistance characteristic by decreasing dishing of solid phase epitaxy (SPE) silicon during planarization in a landing plug forming process via use of SPE silicon, and a method of manufacturing the same. The method of manufacturing a semiconductor device in accordance with the present invention comprises, forming a plurality of gates on a semiconductor substrate; forming an interlayer dielectric film thereon, such that the gates are embedded; selectively etching the interlayer dielectric film to open a landing plug-forming region; depositing SPE silicon, such that the opened landing plug-forming region in the interlayer dielectric film is embedded; implanting boron ions into the SPE silicon; and annealing the resulting boron ion-implanted structure.