The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7343922 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 18, 2008

Filed:

Apr. 12, 2005
Applicants:

Jae-hyung Jung, Kyunggi-do, KR;

Young-min Kwon, Kyunggi-do, KR;

Jong-jae Lee, Kyunggi-do, KR;

Dong-hoon Jung, Kyunggi-do, KR;

Inventors:

Jae-Hyung Jung, Kyunggi-do, KR;

Young-Min Kwon, Kyunggi-do, KR;

Jong-Jae Lee, Kyunggi-do, KR;

Dong-Hoon Jung, Kyunggi-do, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B08B 5/00 (2006.01); F26B 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wafer drying method includes submerging a wafer in a cleaning solution in a dry chamber. An organic liquid vapor from an organic liquid is supplied into the dry chamber at a first volumetric supply rate to form an organic liquid layer on a surface of the cleaning solution, the organic liquid layer having at least a prescribed concentration of the organic liquid. The organic liquid vapor is supplied into the dry chamber at a second volumetric supply rate that is lower than the first volumetric supply rate. During and/or following the supplying of the organic liquid vapor into the dry chamber, at least a portion of the wafer is removed from the cleaning solution through the organic liquid layer.


Find Patent Forward Citations

Jung, Jae-Hyung. (2008). Wafer drying apparatus (U.S. Patent No. 7343922). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7343922

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