The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 18, 2008

Filed:

Sep. 16, 2002
Applicants:

Shunji Miyakawa, Tokyo-to, JP;

Yasuhide Nakajima, Tokyo-to, JP;

Soichi Matsuo, Tokyo-to, JP;

Inventors:

Shunji Miyakawa, Tokyo-to, JP;

Yasuhide Nakajima, Tokyo-to, JP;

Soichi Matsuo, Tokyo-to, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F26B 13/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

A vacuum drying apparatus and a vacuum drying method are provided wherein it is possible to reduce the drying time of an object to be dried and the surface condition of the object to be dried after drying is extremely satisfactory. A vacuum pump is connected to an exhaust port of a vacuum chamber through a suction pipe, and a frequency converter is provided on the input side of an alternating current motor for driving the vacuum pump to form a vacuum drying apparatus. A substrate coated with coating liquid is placed in the vacuum chamber of the vacuum drying apparatus. A gas in the vacuum chamber is exhausted at a high rate until the solvent evaporation rate of the solvent of the coating liquid comes to the vacuum degree that is slightly lower than the vacuum degree at which the evaporation rate of the solvent of the coating liquid is abruptly elevated, and thereafter, the gas in the vacuum chamber is exhausted at a low rate to cause the solvent of the coating liquid to evaporate gradually, and after evaporation of the solvent of the coating liquid, the pressure in the vacuum chamber are returned to the atmospheric pressure.


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