The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2008
Filed:
Jan. 30, 2006
Applicants:
Bong-seok Suh, Hwaseong-si, KR;
Seung-man Choi, Hwaseong-si, KR;
Hong-jae Shin, Seoul, KR;
Young-jin Wee, Seongnam-si, KR;
Inventors:
Bong-seok Suh, Hwaseong-si, KR;
Seung-man Choi, Hwaseong-si, KR;
Hong-jae Shin, Seoul, KR;
Young-jin Wee, Seongnam-si, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8242 (2006.01);
U.S. Cl.
CPC ...
Abstract
Provided are a semiconductor device including a reliable interconnect and a method of manufacturing the same. The semiconductor device includes a substrate, an inter-metal dielectric (IMD) pattern having an opening, an amorphous metallic nitride layer formed on the inner surface of the opening, a diffusion barrier layer formed on the amorphous metallic nitride layer, and a conductive layer filled into the opening having the diffusion barrier layer.