The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2008
Filed:
May. 18, 2006
Kuang-woo Nam, Seoul, KR;
Yun-kwon Park, Dongducheon-si, KR;
In-sang Song, Seoul, KR;
Jea-shik Shin, Suwon-si, KR;
Seok-mo Chang, Incheon, KR;
Seok-chul Yun, Suwon-si, KR;
Kuang-woo Nam, Seoul, KR;
Yun-kwon Park, Dongducheon-si, KR;
In-sang Song, Seoul, KR;
Jea-shik Shin, Suwon-si, KR;
Seok-mo Chang, Incheon, KR;
Seok-chul Yun, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter mounted on the device substrate; a bonding layer stacked on a certain area of the device substrate; a packaging substrate having a cavity formed over the balance filter, and combined with the device substrate by the bonding layer; a balun located on a certain area over the packaging substrate; and an insulator layer for passivating the balun. Accordingly, the present invention can reduce an element size and simplify a manufacturing process.