The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2008
Filed:
Jun. 20, 2003
Hamid G Kia, Bloomfield Hills, MI (US);
Harry a Mitchell, Sterling Heights, MI (US);
Terrence J Wathen, Sterling Heights, MI (US);
Mark a Buffa, Utica, MI (US);
Hamid G Kia, Bloomfield Hills, MI (US);
Harry A Mitchell, Sterling Heights, MI (US);
Terrence J Wathen, Sterling Heights, MI (US);
Mark A Buffa, Utica, MI (US);
General Motors Corporation, Detroit, MI (US);
Abstract
Composite articles are prepared by a spray up operation. In a first step, a gel coat is applied onto a mold surface which has been optionally pretreated with a mold release coating. Next, a barrier coat is applied over the gel coat in the mold and thereafter a laminate formula is applied over the barrier coat. The laminate contains from 40-80% by weight paste and from 20-60% by weight reinforcing fibers. In a preferred embodiment, the paste comprises 90% or more by weight resin, up to 5% filler, and an initiator composition capable of initiating cure at a temperature of 50° C. or lower. In a preferred embodiment, the multilayer composite has a thickness of about 15 mm or less, and is useful as an automobile body panel. The laminate preferably comprises a low shrink, low density glass fiber filled polyester resin. In a preferred embodiment, the paste of the laminate contains a dicyclopentadiene unsaturated polyester resin, polymeric hollow microspheres, and an initiator capable of initiating curing at room temperature or at temperature of 50° C. or less.