The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2008
Filed:
Apr. 27, 2004
David B. Slater, Jr., Raleigh, NC (US);
Jayesh Bharathan, Santa Barbara, CA (US);
John Edmond, Cary, NC (US);
Mark Raffetto, Santa Barbara, CA (US);
Anwar Mohammed, San Jose, CA (US);
Peter S. Andrews, Greensboro, NC (US);
Gerald H. Negley, Hillsborough, NC (US);
David B. Slater, Jr., Raleigh, NC (US);
Jayesh Bharathan, Santa Barbara, CA (US);
John Edmond, Cary, NC (US);
Mark Raffetto, Santa Barbara, CA (US);
Anwar Mohammed, San Jose, CA (US);
Peter S. Andrews, Greensboro, NC (US);
Gerald H. Negley, Hillsborough, NC (US);
Cree, Inc., Durham, NC (US);
Abstract
Bonding of flip-chip mounted light emitting devices having an irregular configuration is provided. Light emitting diodes having a shaped substrate are bonded to a submount by applying forces to the substrate an a manner such that shear forces within the substrate do not exceed a failure threshold of the substrate. Bonding a light emitting diode to a submount may be provided by applying force to a surface of a substrate of the light emitting diode that is oblique to a direction of motion of the light emitting diode to thermosonically bond the light emitting diode to the submount. Collets for use in bonding shaped substrates to a submount and systems for bonding shaped substrates to a submount are also provided.