The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2008
Filed:
May. 26, 2005
Ryosuke Usui, Aichi, JP;
Hiroyuki Watanabe, Aichi, JP;
Takeshi Nakamura, Gunma, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
A circuit device which enables easy formation of a connection part that connects wiring layers to each other, and a manufacturing method thereof are provided. In a method for manufacturing a hybrid integrated circuit device of the present invention, a first resin film is formed so as to cover a first wiring layer. Thereafter, a first through-hole is formed, which penetrates the first resin film and exposes the first wiring layer from a bottom thereof. Next, a second resin film is formed so as to fill up the first through-hole. Moreover, a second through-hole is formed in the second resin film buried in the first through-hole, and a connection part is formed.