The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2008
Filed:
Nov. 22, 2004
James Jen Ho Wang, Phoenix, AZ (US);
Justin E. Poarch, Gilbert, AZ (US);
James Jen Ho Wang, Phoenix, AZ (US);
Justin E. Poarch, Gilbert, AZ (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
Multi-chip semiconductor device assemblies and methods for fabricating such assemblies are provided. An exemplary assembly comprises a first chip having a first surface and comprising a plurality of conductive pads disposed at the first surface and a plurality of circuits. Each of the pads is electrically coupled to one of the circuits. A second chip having a second surface is disposed adjacent to the first surface of the first chip. The second chip comprises a plurality of bonding members disposed at the second surface. Each of the bonding members is connected to a corresponding pad. The second chip is electrically coupled to at least one of the circuits via a corresponding pad and a corresponding bonding member. The second chip comprises a first and a second portion. The first portion overlies at least a portion of the first chip and the second portion extends beyond the first chip.