The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7339270 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 04, 2008

Filed:

Jul. 25, 2006
Applicant:

Shinichi Ogawa, Osaka, JP;

Inventor:

Shinichi Ogawa, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device has a porous low-dielectric-constant film formed on a substrate and having an opening and a fine particle film composed of a plurality of aggregately deposited fine particles each having a diameter of not less than 1 nm and not more than 2 nm and formed on a surface of the portion of the porous low-dielectric-constant film which is formed with the opening. The fine particles are filled in voids exposed at the surface of the portion of the porous low-dielectric-constant film which is formed with the opening.


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Ogawa, Shinichi. (2008). Semiconductor device and method for fabricating the same (U.S. Patent No. 7339270). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7339270

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