The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2008
Filed:
Nov. 19, 2001
Hiroaki Matsuki, Kobe, JP;
Masayoshi Shouno, Kobe, JP;
Tomohiko Tamaki, Kobe, JP;
Fujitsu Ten Limited, Kobe-shi, JP;
Abstract
A high frequency IC package and high frequency unit are simplified and downsized, and the number of manufacturing processes is reduced. The partto determine a characteristic of the high frequency IC chip is arranged outside the sealingof the high frequency IC package. The part can be arranged on the package board, circuit boardor housing chassis. When the part is arranged outside the sealing, the package and the high frequency uniton which the package is mounted can be downsized. In the case of arranging the part on the circuit board, the part can be mounted together with other surface mounting parts. Therefore, the number of manufacturing processes can be reduced.