The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2008

Filed:

Aug. 27, 2004
Applicants:

Yasuhiro Sugimoto, Konan, JP;

Kazunaga Higo, Inuyama, JP;

Kazuhiro Suzuki, Kasugai, JP;

Inventors:

Yasuhiro Sugimoto, Konan, JP;

Kazunaga Higo, Inuyama, JP;

Kazuhiro Suzuki, Kasugai, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 23/02 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01); H01H 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wiring board comprising: a plate core having a first main surface and a second main surface; conductor layers including a conductor line; dielectric layers laminated alternately with said conductor layers on at least one of said first and second main surfaces; via conductors as defined herein; a signal through-hole as defined herein; a signal through-hole conductor as defined herein; a first path end pad as defined herein; a second path end pad as defined herein; a shield through-hole as defined herein; and a shield through-hole conductor as defined herein; wherein: a signal transmission path is formed as defined herein; at least one of said conductor layers is disposed on each of said first and second main surface sides; said surface conductor on said first main surface side and said conductor line form a strip line, a microstrip line, or a coplanar waveguide with constant characteristic impedance Z; an inner surface of said shield through-hole is covered with said shield through-hole conductor; and an interaxis distance between said signal through-hole conductor and said shield through-hole conductor is adjusted as defined herein.


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