The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2008
Filed:
Apr. 26, 2005
Isao Ozawa, Chigasaki, JP;
Akihito Ishimura, Yokohama, JP;
Yasuo Takemoto, Yokohama, JP;
Tetsuya Sato, Yokkaichi, JP;
Isao Ozawa, Chigasaki, JP;
Akihito Ishimura, Yokohama, JP;
Yasuo Takemoto, Yokohama, JP;
Tetsuya Sato, Yokkaichi, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A lead frame has a plurality of first inner leads having distal end portions and parallel to each other, and a plurality of second inner leads having distal end portions opposing the distal end portions of the first inner leads, longer than the first inner leads, and parallel to each other. The semiconductor chip has a plurality of bonding pads arranged along one side of an element formation surface, and is mounted on the surfaces of the plurality of second inner leads using an insulating adhesive. The plurality of bonding wires include first bonding wires which electrically connect the distal end portions of the plurality of first inner leads to some of the plurality of bonding pads, and a plurality of second bonding wires which electrically connect the distal end portions of the plurality of second inner leads to the rest of the plurality of bonding pads.