The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2008
Filed:
Dec. 20, 2004
Applicants:
Kazuaki Inukai, Shizwoka, JP;
Atsushi Matsushita, Nagasaki, JP;
Inventors:
Kazuaki Inukai, Shizwoka, JP;
Atsushi Matsushita, Nagasaki, JP;
Assignee:
Rohm Co., Ltd., Kyoto-Shi, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of fabricating a semiconductor device includes forming a metal wire on a substrate, forming an interlayer insulating film on the metal wire, forming a resist pattern on the interlayer insulating film, selectively etching the interlayer film to form a trench or via-hole in the interlayer insulating film and reaching the metal wire, and ashing, using a reducing gas, to remove the resist pattern.
Inukai, Kazuaki. (2008). Method of fabricating a semiconductor device having metal wiring (U.S. Patent No. 7338897). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7338897
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile