The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2008
Filed:
Jun. 01, 2006
Kyung Taeg Han, Kyungki-do, KR;
Hun Joo Hahm, Kyungki-do, KR;
Dae Yeon Kim, Kyungki-do, KR;
Ho Sik Ahn, Kyungki-do, KR;
Seong Yeon Han, Kyungki-do, KR;
Young Sam Park, Seoul, KR;
Seon Goo Lee, Kyungki-do, KR;
Kyung Taeg Han, Kyungki-do, KR;
Hun Joo Hahm, Kyungki-do, KR;
Dae Yeon Kim, Kyungki-do, KR;
Ho Sik Ahn, Kyungki-do, KR;
Seong Yeon Han, Kyungki-do, KR;
Young Sam Park, Seoul, KR;
Seon Goo Lee, Kyungki-do, KR;
Samsung Electro-Mechanics Co., Ltd., Kyungki-Do, KR;
Abstract
The invention relates to a side-emitting LED package and a manufacturing method of the same. The invention provides a side-emitting LED package for emitting light from a light source sideward including a substrate with an electrode formed thereon. The package also includes a light source disposed on the substrate, a molded part that covers and protects the substrate with the light source thereon, and a reflective layer that covers an outer surface of the molded part. The molded part with the reflective layer forms a light transmitting surface in one side thereof. The invention allows easy manufacture of a reflecting surface in a desired shape, miniaturization regardless of the LED chip size, mass-production in an LED array, significantly improving productivity.