The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2008

Filed:

Oct. 30, 2003
Applicants:

Koyata Takahashi, Sagamihara, JP;

Masanori Kohgo, Fujisawa, JP;

Osamu Matsunaga, Sagamihara, JP;

Inventors:

Koyata Takahashi, Sagamihara, JP;

Masanori Kohgo, Fujisawa, JP;

Osamu Matsunaga, Sagamihara, JP;

Assignee:

Tosoh Corporation, Yamaguchi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

In film-forming devices and plasma-processing devices, filmy matter adheres to the surfaces of the inner parts and it peels to cause dust and particles in the devices. In the devices, the dust and particles contaminate the objects for film formation thereon or the objects to be processed with plasma. For preventing the objects from being contaminated with them, the inner parts of the devices must be frequently exchanged every time when they have received any minor filmy matter thereon, and this lowers the productivity in the devices. When a modified glass part of which the surface is modified with spherical or bell-like island projections having a width and a height of from a few μm to a few hundreds μm is used in a film-forming device and in a plasma-processing device, then its ability to hold the filmy substance having adhered thereto is good and its resistance to plasma is also good. Therefore, the surface-modified part does not produce dust and particles and solves the problem of contamination of products. In addition, since the surface-modified part of the type has few pores and therefore releases few particles and little gas. Moreover, since the stress to be caused by the thermal expansion difference between the island projections and the substrate of the surface-modified part is small, the part does not peel even when heated, and it is favorable to vacuum devices.


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