The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2008

Filed:

Aug. 12, 2004
Applicant:

Hi-choon Lee, Gyeonggi-do, KR;

Inventor:

Hi-Choon Lee, Gyeonggi-do, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01); H01L 29/00 (2006.01); G01C 7/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor memory integrated circuit includes a plurality of pads; a peripheral circuit having a plurality of control circuits which are arranged at locations adjacent to the plurality of the pads and receive a plurality of input signals to generate a plurality of output signals in response to a plurality of control signals, respectively; and a plurality of fuse circuits for generating the plurality of the control signals, said fuse circuits being arranged between the plurality of the pads and the peripheral circuit. Since the integrated circuit has the fuse circuits at a location adjacent to the pads, the characteristics of the IC can be changed even after the package test when a small region is opened.


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