The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2008
Filed:
May. 25, 2005
Kenneth E. Goodson, Belmont, CA (US);
Chuan-hua Chen, Stanford, CA (US);
David E. Huber, Mountain View, CA (US);
Linan Jiang, Menlo Park, CA (US);
Thomas W. Kenny, San Carlos, CA (US);
Jae-mo Koo, Stanford, CA (US);
Daniel J. Laser, San Francisco, CA (US);
James C. Mikkelsen, Los Altos, CA (US);
Juan G. Santiago, Fremont, CA (US);
Evelyn Ning-yi Wang, Stanford, CA (US);
Shulin Zeng, Sunnyvale, CA (US);
Lian Zhang, Sunnyvale, CA (US);
Kenneth E. Goodson, Belmont, CA (US);
Chuan-Hua Chen, Stanford, CA (US);
David E. Huber, Mountain View, CA (US);
Linan Jiang, Menlo Park, CA (US);
Thomas W. Kenny, San Carlos, CA (US);
Jae-Mo Koo, Stanford, CA (US);
Daniel J. Laser, San Francisco, CA (US);
James C. Mikkelsen, Los Altos, CA (US);
Juan G. Santiago, Fremont, CA (US);
Evelyn Ning-Yi Wang, Stanford, CA (US);
Shulin Zeng, Sunnyvale, CA (US);
Lian Zhang, Sunnyvale, CA (US);
The Board of Trustees of the Leland Stanford Junior University, Palo Alto, CA (US);
Abstract
Apparatus and methods according to the present invention utilize micropumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These micropumps are fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These micropumps also can allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the spatial and temporal characteristics of the device temperature profiles. Novel enclosed microchannel structures are also described.