The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2008
Filed:
Apr. 20, 2006
Guo Tao Liu, Hangzhou, CN;
Shanquan Bao, Alameda, CA (US);
Taojin Le, Hangzhou, CN;
William X. Huang, San Ramon, CA (US);
Meng-en Tan, Hangzhou, CN;
Guo Tao Liu, Hangzhou, CN;
Shanquan Bao, Alameda, CA (US);
Taojin Le, Hangzhou, CN;
William X. Huang, San Ramon, CA (US);
Meng-en Tan, Hangzhou, CN;
UTStarcom, Inc., Alameda, CA (US);
Abstract
A heat dissipation system for a miniaturized form factor card allows a communications system for mobile information devices contained in the card to operate with high heat loads by employing a high conductivity pad on the printed circuit board of the mobile information device which contacts the case of the miniaturized form factor card. Additionally, heat dissipation plugs are integrated into the edge of the PCB with emitting surfaces adjacent radiation holes in the case of the mobile information device adjacent the PCB. Heat convection channels through layers of the PCB allow transfer of heat from the pad to other conductive layers in the PCB. High thermal conductivity packing in the miniaturized form factor card conducts heat from the internal components to the case of the card in contact with the high conductivity. Placement of high heat generation components within the card case adjacent the contact interface with the high conductivity pad is also employed for maximum heat dissipation. A high conductivity membrane is provided on the card case for increased conductivity from the case into the pad on the PCB.