The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2008
Filed:
Aug. 29, 2003
Kimitoshi Etoh, Odawara, JP;
Nobuo Yoshida, Odawara, JP;
Moriaki Fuyama, Hitachi, JP;
Makoto Morijiri, Ninomiya, JP;
Kenichi Meguro, Matsuda, JP;
Ichiro Oodake, Odawara, JP;
Kazue Kudo, Odawara, JP;
Yohji Maruyama, Iruma, JP;
Katsuro Watanabe, Kanasagou, JP;
Kimitoshi Etoh, Odawara, JP;
Nobuo Yoshida, Odawara, JP;
Moriaki Fuyama, Hitachi, JP;
Makoto Morijiri, Ninomiya, JP;
Kenichi Meguro, Matsuda, JP;
Ichiro Oodake, Odawara, JP;
Kazue Kudo, Odawara, JP;
Yohji Maruyama, Iruma, JP;
Katsuro Watanabe, Kanasagou, JP;
Hitachi Global Storage Technologies Japan, Ltd., Odawara-shi, JP;
Abstract
A thin-film magnetic head having little temperature rise in the element, good heat dissipation and a short magnetic path length (narrow coil pitch) and manufacturing method for same is provided. To form the coil of the thin-film magnetic head, a lower coil is first formed and after forming alumina and an inorganic compound containing alumina, a trench is formed for the upper coil by reactive ion etching. The lower coil allows uniform etching at this time and functions as a film to prevent loading effects occurring during reactive ion etching. This trench is then plated in copper and chemical mechanical planarization performed to form the upper layer coil as the dual-layer coil of the present invention. Heat from the coil is efficiently radiated towards the substrate by alumina and an inorganic compound containing alumina with good heat propagation. The ratio of alumina or inorganic compound containing alumina in the lower coil can be selected by reactive ion etching so that an upper coil trench functioning as an etching stopper can be securely formed to allow forming a stable coil film thickness and a short magnetic path length.