The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2008

Filed:

May. 10, 2005
Applicants:

Chris Togami, San Jose, CA (US);

Gary Sasser, San Jose, CA (US);

Rudolf J. Hofmeister, Sunnyvale, CA (US);

Paul K. Rosenberg, Sunnyvale, CA (US);

Frank H. Levinson, Singapore, SG;

Axel Mehnert, Sunnyvale, CA (US);

Inventors:

Chris Togami, San Jose, CA (US);

Gary Sasser, San Jose, CA (US);

Rudolf J. Hofmeister, Sunnyvale, CA (US);

Paul K. Rosenberg, Sunnyvale, CA (US);

Frank H. Levinson, Singapore, SG;

Axel Mehnert, Sunnyvale, CA (US);

Assignee:

Finisar Corporation, Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 11/00 (2006.01); G02B 6/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

The principles of the present invention relate to aligning optical components with three degrees of translational freedom. A lens pin, a lens base, and a molded package are aligned in a first direction, a second direction, and a third direction such that the signal strength of optical signals transferred between a lens included in the lens pin and the molded package is optimized. The lens pin is mechanically coupled to the lens base to fix the position of the lens relative to the molded package in the first direction. Subsequently, the lens base and the molded package are realigned in the second and third directions such that the signal strength is again optimized. The lens base is mechanically coupled to the molded package to fix the position of the lens base relative to the molded package in the second and third directions.


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