The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2008

Filed:

May. 15, 2006
Applicants:

Basil H. Scott, Kapaa, HI (US);

Randy Wolfshagen, Koloa, HI (US);

Jeff Buck, Kapaa, HI (US);

Inventors:

Basil H. Scott, Kapaa, HI (US);

Randy Wolfshagen, Koloa, HI (US);

Jeff Buck, Kapaa, HI (US);

Assignee:

Oceanit Laboratories, Inc., Honolulu, HI (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01C 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A Sensor Chip Assembly (SCA) contains a focal plane array constructed as a semiconductor chip sandwich. One slice contains an array of PSDs made from IR sensitive semiconductor material, and the other slice contains Trans Impedance Amplifiers (TIAs)—and associated on-chip signal processing elements from an electronic semiconductor material. The SCA resembles those made for pixelized imaging IR SCA focal planes, but the configuration and implementation of which is for a PSD focal plane array. The use of these techniques assures that the PSD focal plane array possesses the required attributes. Interconnect technology is widely available from most IR fabrication houses to connect the IR array with the TIA circuits.


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