The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2008
Filed:
Apr. 13, 2004
Hiroko Tsukamoto, Aichi, JP;
Hideki Mori, Aichi, JP;
Atsushi Tsuzuki, Aichi, JP;
Hisao Yamaguchi, Aichi, JP;
Mahito Hamada, Tokyo, JP;
Toshimi Kamikawa, Tokyo, JP;
Hiroko Tsukamoto, Aichi, JP;
Hideki Mori, Aichi, JP;
Atsushi Tsuzuki, Aichi, JP;
Hisao Yamaguchi, Aichi, JP;
Mahito Hamada, Tokyo, JP;
Toshimi Kamikawa, Tokyo, JP;
Toyoda Gosei Co., Ltd., Nishikasugai-gun, Aichi, JP;
Stanley Electric Co., Ltd., Tokyo, JP;
Abstract
In an LED lamp, a copper film is first formed on a substrate by plating. A resist is then bonded onto the copper film so that shaped like a ring viewed from the whole of the LED lamp. A nickel and a gold film are formed on a portion of the copper film where the resist is not bonded. Next, an adhesive agent is applied onto a bottom of the lamp house so that the lamp house is bonded onto the substrate through the adhesive agent. A transparent epoxy resin is packed in the frame of the lamp house and hardened by heating to perform resin sealing. Since the resist is bonded onto the surface of copper having a large number of fine irregularities sufficient to ensure a large contact area and excellent in adhesion, separation can be prevented from being caused by thermal stress.