The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2008
Filed:
Mar. 01, 2002
Arild Follestad, Stathelle, NO;
Espen Ommundsen, Langesund, NO;
Knut Fosse, Skien, NO;
Borealis Technology Oy, Porvoo, FI;
Abstract
A polymer composition suitable for rotomoulding comprising I) An ethylene homopolymer or copolymer with at least one other C3-10 ? olefin, having a melt flow rate of 0.5 to 30, a molecular weight distribution (Mw/Mn) of less than 4, an Mw of 50,000 to 110,000, a density of 0.940 g/cm3 to 0.970 g/cm3 and a melting point of 100 to 145° C.; or I) a propylene homopolymer or copolymer with at least one other C2-10 ? olefin, having a melt flow rate of 0.5 to 30, a molecular weight distribution (Mw/Mn) of less than 4, an Mw of 150,000 to 300,000, and a melting point of 100 to 170° C.; and II) an ethylene homo or copolymer with at least one other C3-10 ?-olefin, having a melt flow rate of within 40% of the melt flow rate of component (I), a molecular weight distribution of (Mw/Mn) of less than 4, an Mw of within 30% of the Mw of component (I), a density of 0.880 g/cm3 to 0.940 g/cm3 said density being at least 0.010 g/cm3 less than the density of component (I) and a melting point of at least 5° C. less than that of component (I); or II) a propylene homo or copolymer with at least one other C2-10 ?-olefin having a melt flow rate of within 40% of the melt flow rate of component (I), a molecular weight distribution of (Mw/Mn) of less than 4, an Mw of within 30% of the Mw of component (I), and a melting point of at least 10° C. less than that of component (I).