The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7332374 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 19, 2008

Filed:

Nov. 09, 2005
Applicants:

Lawrence J. Maher, Lake in the Hills, IL (US);

Robert Churchill, Wauconda, IL (US);

Inventors:

Lawrence J. Maher, Lake in the Hills, IL (US);

Robert Churchill, Wauconda, IL (US);

Assignee:

Northrop Grumman Corporation, Los Angeles, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method is provided for manufacturing electronic module assemblies comprising a plurality of substrates and a housing. The method comprises providing an alignment plate having a plurality of protrusions disposed through an upper surface thereof, wherein the protrusions are positioned on the alignment plate according to a predetermined substrate layout pattern; positioning the substrates on the alignment plate in between respective ones of the protrusions such that repeatable gaps may be created between the substrates; applying strips of tape over common edges of the substrates to form a sheet of substrates; removing the sheet from the alignment plate; trimming excess tape from the sheet; cleaning the housing and sheet; placing an epoxy preform within the housing; placing the sheet of substrates onto the preform while aligning key artwork from the sheet to housing walls, pins or tabs integrally formed within the housing; securing the sheet of substrates within the housing using spot tape; vacuum curing the module assembly; and removing the tape from the module assembly.


Find Patent Forward Citations

Maher, Lawrence. (2008). Prealignment and gapping for rf substrates (U.S. Patent No. 7332374). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7332374

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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