The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2008
Filed:
Jun. 03, 2004
Kunihiko Tokura, Tokyo, JP;
Masaru Uryu, Chiba, JP;
Kunihiko Tokura, Tokyo, JP;
Masaru Uryu, Chiba, JP;
Sony Corporation, , JP;
Abstract
A resin-molded component such as a loudspeaker diaphragm, in which rigidity is enhanced while light weight and high specific modulus of elasticity are maintained, is formed by applying carbon dioxide gas with a predetermined pressure to a thermoplastic resin in which crystallization is facilitated in the resin flowing direction to fill a mold. After the resin is filled, injection molding is performed by somewhat moving the mold to form five layers of: oriented minute-foaming layers, having approximately cylindrical foams, the length of which is twice the diameter thereof in the resin flowing direction in the mold, an unfoamed core layer positioned between both the foaming layers, and unfoamed skin layers formed on the front and rear surfaces.