The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7332214 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 19, 2008

Filed:

Sep. 12, 2001
Applicants:

Akio Ozasa, Kyoto, JP;

Akihisa Hashimoto, Kyoto, JP;

Rumi Shinohara, Ibaraki, JP;

Shinji Tanaka, Takatsuki, JP;

Inventors:

Akio Ozasa, Kyoto, JP;

Akihisa Hashimoto, Kyoto, JP;

Rumi Shinohara, Ibaraki, JP;

Shinji Tanaka, Takatsuki, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); B32B 9/00 (2006.01); B29C 44/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

Biodegradable molded articles; a process for producing the same: and compositions for foam molding packed in a packaging film bag to be used in the production. A bowl-type container(), which is one of the biodegradable molded articles as described above, consists of a bowl body() comprising starch as the main component and a coating film() having at least hydrophobic properties and comprising a biodegradable plastic as the main component which is bonded to the surface of the bowl body(). This bowl body() is formed by steam-foaming molding a material to be molded which is in the form of a slurry or a dough containing starch and water. The coating film() is closely bonded to the surface of the bowl body() either directly or via an adhesive layer. Compositions for foam molding packed in such packaging film bags can be easily stored and molded.


Find Patent Forward Citations

Ozasa, Akio. (2008). Biodegradable molded article, manufacturing method thereof, and composition for expansion molding (U.S. Patent No. 7332214). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7332214

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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