The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2008

Filed:

Dec. 19, 2003
Applicants:

Lucia Giovanola, Ivrea, IT;

Renato Conta, Ivrea, IT;

Inventors:

Lucia Giovanola, Ivrea, IT;

Renato Conta, Ivrea, IT;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01D 15/00 (2006.01); G11B 5/127 (2006.01);
U.S. Cl.
CPC ...
Abstract

Process for protectively coating against aggressive liquids hydraulic microcircuits made in a resin, particularly for an ink jet printhead, consisting of: disposing of a silicon substrate comprising a sacrificial layer of copper, deposited on the substrate and defining the inner shape of the hydraulic microcircuits; depositing on top of the outer surface of the sacrificial layer, by means of an electrochemical process, at least one protective, metallic coating layer; applying on the sacrificial layer a non-photosensitive epoxy or polyamide resin, having a predetermined thickness and suitable for completely covering the sacrificial layer; effecting a polymerization of the resin to increase its mechanical resistance to mechanical and thermal stresses and performing a planarization of the outer surface of the resin, by means of a mechanical lapping and simultaneous chemical treatment; removing the sacrificial layer through a chemical etching in a highly acid bath; and depositing a metallic, protective layer on the outer surface of the resin through vacuum evaporation.


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