The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2008

Filed:

Aug. 24, 2004
Applicants:

Mitsuzo Shida, Long Grove, IL (US);

Mark S. Pucci, Elk Grove Village, IL (US);

Kuniyasu Kato, Arlington Heights, IL (US);

Hideshi Onishi, Kurashiki, JP;

Inventors:

Mitsuzo Shida, Long Grove, IL (US);

Mark S. Pucci, Elk Grove Village, IL (US);

Kuniyasu Kato, Arlington Heights, IL (US);

Hideshi Onishi, Kurashiki, JP;

Assignees:

The Nippon Synthetic Chemical Industry Co., Ltd., Osaka, JP;

SOARUS, L.L.C., Arlington Heights, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 11/00 (2006.01); C08J 11/16 (2006.01); C08J 11/26 (2006.01); C08J 3/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a resin composition that is added when a multi-layer structure containing hydrolyzed ethylene-vinyl acetate copolymer is reground into a multi-layer structure and a process for preparing a multi-layer structure using the resin composition. Specifically, the present invention relates to a resin composition comprising (A) polyolefin, (B) metal salt of higher fatty acid having 12 to 30 carbon atoms and (C) zeolite. Also, the multi-layer structure is prepared by the process of regrinding by adding the resin composition to a multi-layer structure containing hydrolyzed ethylene-vinyl acetate copolymer.


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