The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2008
Filed:
Sep. 30, 2005
Naoshi Adachi, Tokyo, JP;
Naoshi Adachi, Tokyo, JP;
Sumco Corporation, Tokyo, JP;
Abstract
A heat treatment jig by the invention comprising: the diameter of a disk-type structure being 60% or more of that of loaded semiconductor wafers; the thickness being 1.0 mm or more but 10 mm or less; the surface roughness Ra of 0.1 μm or more but 100 μm or less at a contacting surface with the wafers; and the surface planarity being specifically controlled in the concentric direction as well as in the diametrical direction, otherwise in place of above planarity, comprising a controlled maximum height in such a way that the maximum height is obtained by the flatness measurement at the multiple positions and the difference between said maximum height and the hypothetical-average-height-plane thus set is 50 μm or less, can reduce the slip generation due to the close adhesion of the wafers and the jig. Owing to this, even if the wafers having large tare weight should be heat-treated, the slip generation can be effectively prevented, thus enabling the jig to be widely used as the reliable heat treatment jig for semiconductor substrates.