The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2008
Filed:
Mar. 19, 2001
Ryoichi Okada, Utsunomiya, JP;
Hitoshi Aoki, Utsunomiya, JP;
Yoshitaka Okugawa, Utsunomiya, JP;
Kensuke Nakamura, Utsunomiya, JP;
Shinichiro Itoh, Utsunomiya, JP;
Ryoichi Okada, Utsunomiya, JP;
Hitoshi Aoki, Utsunomiya, JP;
Yoshitaka Okugawa, Utsunomiya, JP;
Kensuke Nakamura, Utsunomiya, JP;
Shinichiro Itoh, Utsunomiya, JP;
Abstract
In a process for producing an electronic part which comprises soldering (A) an electronic member having conductor portions I for electric connection having a solder layer or a solder bump (a solder portion) on a surface of a tip and (B) an electronic member to be connected having conductor portions II for electric connection arranged at positions corresponding to positions of conductor portions I by pressing (A) to (B) under heating via an adhesive layer, the solder portion is brought into contact with the adhesive layer, the solder portion is melted by heating at a temperature of or higher than a melting point of the solder, the soldering is conducted by pressing the melted solder portion, and the adhesive layer is cured. An electronic part is obtained in accordance with the process. Electric connection is surely achieved and a highly reliable electronic part can be obtained with excellent productivity.