The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2008
Filed:
Dec. 06, 2005
Applicants:
Hee-seok Lee, Gyeonggi-do, KR;
Kyung-lae Jang, Gyeonggi-do, KR;
Tae-je Cho, Gyeonggi-do, KR;
Ki-won Choi, Gyeonggi-do, KR;
Inventors:
Hee-Seok Lee, Gyeonggi-do, KR;
Kyung-Lae Jang, Gyeonggi-do, KR;
Tae-Je Cho, Gyeonggi-do, KR;
Ki-Won Choi, Gyeonggi-do, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01);
U.S. Cl.
CPC ...
Abstract
A printed circuit board for a high-speed semiconductor package uses bonding wires as a shield structure, e.g., to shield an open portion of signal transmission lines, and thereby reduce the likelihood of coupling noises, e.g., between signal transmission lines.