The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2008

Filed:

Mar. 21, 2005
Applicants:

Jun Sakano, Gunma, JP;

Kouji Takahashi, Gunma, JP;

Yusuke Igarashi, Gunma, JP;

Inventors:

Jun Sakano, Gunma, JP;

Kouji Takahashi, Gunma, JP;

Yusuke Igarashi, Gunma, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/13 (2006.01); H05K 1/00 (2006.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing a circuit device includes the steps of preparing a conductive foil, forming conductive patterns in convex shapes by forming an isolation trench on a surface of the conductive foil, covering the surface of the conductive foil with a resin film so as to form the resin film covering the isolation trench thicker than the resin film covering upper surfaces of the conductive patterns, exposing the upper surfaces of the conductive patterns out of the resin film by removing the resin film, electrically connecting the conductive pattern exposed out of the resin film to a circuit element, forming sealing resin to seal the circuit element, and removing a rear surface of the conductive foil until the conductive patterns are mutually isolated.


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