The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2008
Filed:
May. 14, 2002
Hiroshi Fukui, Chiba Prefecture, JP;
Manabu Sutoh, Chiba Prefecture, JP;
Hiroji Enami, Chiba Prefecture, JP;
Masayuki Onishi, Chiba Prefecture, JP;
Tadashi Okawa, Chiba Prefecture, JP;
Satoshi Onodera, Chiba Prefecture, JP;
Hiroshi Fukui, Chiba Prefecture, JP;
Manabu Sutoh, Chiba Prefecture, JP;
Hiroji Enami, Chiba Prefecture, JP;
Masayuki Onishi, Chiba Prefecture, JP;
Tadashi Okawa, Chiba Prefecture, JP;
Satoshi Onodera, Chiba Prefecture, JP;
Dow Corning Toray Silicone Co., Ltd., Tokyo, JP;
Abstract
A heat-conductive silicone composition comprising at least (A) an organopolysiloxane, (B) a heat-conductive filler, and (C) a specific organosiloxane. The silicone composition is excellent in handleability, even when it contains a large amount of a heat-conductive filler for the purpose of attaining higher heat conductivity.