The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2008
Filed:
Jun. 24, 2005
Manoj Vellaikal, Santa Clara, CA (US);
Hemant P. Mungekar, San Jose, CA (US);
Young S. Lee, Santa Clara, CA (US);
Yasutoshi Okuno, Kyoto, JP;
Hiroshi Yuasa, Kyoto, JP;
Manoj Vellaikal, Santa Clara, CA (US);
Hemant P. Mungekar, San Jose, CA (US);
Young S. Lee, Santa Clara, CA (US);
Yasutoshi Okuno, Kyoto, JP;
Hiroshi Yuasa, Kyoto, JP;
Applied Materials, Inc., Santa Clara, CA (US);
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
Methods deposit a film on a substrate disposed in a substrate processing chamber. The substrate has a gap formed between adjacent raised surfaces. Flows of first precursor deposition gases are provided to the substrate processing chamber. A first high-density plasma is formed from the flows of first deposition gases to deposit a first portion of the film over the substrate and within the gap with a first deposition process that has simultaneous deposition and sputtering components until after the gap has closed. A sufficient part of the first portion of the film is etched back to reopen the gap. Flows of second precursor deposition gases are provided to the substrate processing chamber. A second high-density plasma is formed from the flows of second precursor deposition gases to deposit a second portion of the film over the substrate and within the reopened gap with a second deposition process that has simultaneous deposition and sputtering components.