The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2008
Filed:
Jul. 20, 2004
Gobi R. Padmanabhan, Sunnyvale, CA (US);
Visvamohan Yegnashankaran, Redwood City, CA (US);
Gobi R. Padmanabhan, Sunnyvale, CA (US);
Visvamohan Yegnashankaran, Redwood City, CA (US);
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
Various semiconductor devices can be formed at the end of a common fabrication process, thereby significantly improving manufacturing flexibility, by selectively wiring bonding different CMOS circuits to different MEMS, which are formed on the same semiconductor die. A semiconductor device that has a number of CMOS circuits and a number of MEMS is formed on the same semiconductor wafer in adjacent regions on the wafer, and then diced such that the CMOS circuits and the MEMS are formed on the same die. After dicing, different CMOS circuits and different MEMS can be selectively connected during the wire bonding step to form the different semiconductor devices.